News

Angstrem-T demonstrates product samples at the St. Petersburg International Economic Forum (SPIEF)
Angstrem-T demonstrates product samples
at the St. Petersburg International Economic Forum (SPIEF)

 13.06.2019

Angstrem-T was a key speaker in the panel discussion "Development of technology and production potential of Russian Microelectronics"
On April 17, 2019, Evgeny Kuzmin, SC Angstrem-T's Commercial Director, was a key speaker in the panel discussion "Development of technology and production potential of Russian Microelectronics", organized within the 22nd ExpoElectronica International Exhibition.
 18.04.2019

Angstrem-T is hosting a three-day workshop on latest trends in design of ASIC/SoC, HW systems and IoT/AI solutions
Angstrem-T is hosting a three-day workshop on latest trends in design of ASIC/SoC, HW systems and IoT/AI solutions
 13.03.2019

Angstrem-T starts serial supplies to China

Angstrem-T, Russia's leading semiconductor manufacturer obtained positive findings on its pilot product lots that had been shipped to customers and successfully tested. Shipments will be effected under contracts signed at the St. Petersburg International Economic Forum (SPIEF) in May 2018.


 07.02.2019

Angstrem-T has mastered the Trench MOSFET technology
Angstrem-T has mastered an up-to-date fabrication technology of Trench MOSFET power transistors. Currently, Angstrem-T is the only Russian manufacturer capable of fabricating transistors of this type.
 24.01.2019

Angstrem-T's MPW ICs successfully tested
The first commercial batch in the framework of the MPW1 production project was shipped in July this year. The batch contained chips fabricated with the 250G technology and ordered by Russian design centers. The functional test carried out by the customers has proven full functionality of the ICs fabricated at Angstrem-T's fab.
 11.12.2018

Angstrem-T ships another wafer lot to China
Angstrem-T, Russia's leading manufacturer of semiconductor components, shipped its second lot of wafers to China. The shipment was effected under the contract signed at the St. Petersburg International Economic Forum (SPIEF) in May 2018.
 06.12.2018

Angstrem-T hosts a panel discussion on creating a Digital platform for electronics engineers

On October 18, Angstrem-T hosted a panel discussion with the following focus: "The role of hi-tech industry in creation of innovative products and technologies in tech areas of highest priority".


 24.10.2018

On September 6-9, 2018, Angstrem-Ts CEO, Andrey Anikin, participated in a panel discussion Highlights on Radioelectronic industry development strategy until 2030
On September 6-9, 2018, Angstrem-T’s CEO, Andrey Anikin, participated in a panel discussion “Highlights on Radioelectronic industry development strategy until 2030”
 10.09.2018

Angstrem-T ships its first commercial MPW batch
This July, Angstrem-T shipped its first commercial batch in the framework of the MPW1 production project. The batch contained chips fabricated with the 250G technology and ordered by Russian design centers.


 23.07.2018