About Angstrem-T

JSC Angstrem-T was founded on June 10, 2005.

Our primary goal is implementation of the investment project of establishing a submicron semiconductor manufacture foundry based on 130 nm and 90 nm technologies, with a prospect to shift to 65 nm node.

Our primary business modelis an exhaustive service package for chip wafer production on foundry basis, using our own hi-tech manufacturing facilities, advanced submicron technologies and comprehensive service at all levels of customer relations.

Angstrem-T is establishing our own research and production complex including the following facilities:

  • A process facility with class 1000 clean rooms equipped with all utilities and infrastructure and capable of further technology progress.
  • A set of utility, mechanical, electrical, process, test and measurement, and analytical equipment capable of implementing feature sizes beyond 90 nm.
  • A standalone energy supply center based on trigeneration gas-fuelled power plant with designed capacity of 36 MW.
  • An integrated system for industrial waste treatment constructed to meet highest world and domestic environmental standards.
  • A design center that ensures establishment of all essential design infrastructure and development of our own products oriented towards the production processes.
  • A production line to test the produced wafers and assemble the chips.

The overall facilities complex will allow us to sophisticate the technologies to up to 45 nm node without any fundamental infrastructural reorganization.

The project is designed to use licensed technologies and equipment from the market-leading manufacturers. The process tools are going to be serviced, supported and upgraded to the world’s best standards along the whole project lifetime.

The projects target market is formed up by overseas and domestic fabless companies and design centers specialized in electronic production of the existing and new types.

The main creditor of the project is Vnesheconombank. The total investment volume is 896 mln. of Euros, Vnesheconombank participation is 815 mln. Euros.

On the 30th of July, 2016, the authorization from Moscow State Construction Supervision Committee was received for commissioning of the object. This fact implies that starting from August of this year the company is able to produce, sell products and fulfill the complete commercial activity.

The production facility is being constructed with the following key parameters:

  • Total Clean room area: 7500 m2
  • Production capacity: 15 000 wafer starts per month
  • Wafer diameter: 200 mm
  • Technology: 130–90 nm, 9 metals (Cu)

Key players
AMD Inc, USA

  • Core technology supplier
  • Process tool set supplier
  • Technology transfer supporter

Neolant, Russia

  • General Designer
  • Field design engineering